Thermal stress accommodation in dip cast lead zirconate‐titanate ferroelectric films on flexible substrates

Piezoelectric thin films were dip coat deposited onto flexible metal substrates to investigate the dependence of dielectric and ferroelectric properties on coefficient thermal expansion mismatch substrate thickness. The bending stiffness was controlled by thickness substrate. Grazing incidence X-ray diffraction displayed distinct peak splitting for [Pb0.98▪0.01(Zr0.52Ti0.48)Nb0.02O3] Pt, Ni, Ag, stiff Ni substrates, where out-of-plane d-spacing integrated area c-domains highest with largest film compressive stress. As expected, lead zirconate titanate (PZT) Si under tensile stress contained more in-plane domains. permittivity in PZT lowest thick while remanent polarization opposite trend, commensurate residual state as well resistance a strain-relief mechanism. irreversible Rayleigh decreased dramatically upon poling compared substrates; α ε / i n t l ${\alpha _\varepsilon }/{\varepsilon _{initial}}$ ratio 56% higher relative at 100 Hz prior electrical poling. This investigation distinguishes impact flexibility from domain mobility provides dip-coating conditions high-quality piezoelectric any